Shenzhen Jingxin Electronic Technology Co., Ltd.

Shenzhen Jingxin Electronic Technology Co., Ltd.

Manufacturer from China
Active Member
6 Years
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Acme Digital SMT Electronic PCB Assembly Turnkey Components PCBA 2 Years Guarantee

Acme Digital SMT Electronic PCB Assembly Turnkey Components PCBA 2 Years Guarantee

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Brand Name :JINGXIN
Model Number :JX11269
Certification :UL,RoHS, CE
Place of Origin :CHINA
MOQ :1pc
Price :Negotiable
Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :1000pcs per day
Delivery Time :5-7 days
Packaging Details :ESD package
Min.Line Spacking :0.075mm
Min.Hole Size :0.2mm
Min.Thickness :0.2mm
Features 1 :Gerber/PCB File Needed
Features 2 :100% Testing
Features 3 :2 Years Guarantee
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Acme Digital SMT Electronic PCB Assembly Turnkey Components PCBA

Details:

1. One of the largest and professional PCB (Printed Circuit Board) manufacturers in China with over 500 staff and 20 years’experience.

2. All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver, Immersion Tin, Immersion Gold, Lead-free HASL,HAL.

3. BGA,Blind&Buried Via and Impedance Control is accepted.

4. Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine, CNC drilling machine,Auto-PTH line,AOI(Automatic Optic Inspection),Probe Flying Machine and so on.

5. Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.

6. One of the professional SMT/BGA/DIP/PCB Assembly manufacturers in China with 20 years’experience.

7. High speed advanced SMT lines to reach chip +0.1mm on integrated circuit parts.

8. All kinds of integrated circuits is available,such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA.

9. Also available for 0201 chip placement, through-hole components insertion and finished products fabrication, testing and package.

10. SMD assembly and through-hole components insertion is accepted.

11. IC preprogramming is also accepted.

12. Available for Function verification and burn in testing.

13. Service for complete unit assembly,for example,plastics, metal box, coil, cable inside .

14. Environmental conformal coating to protect finished PCBA products.

15. Providing Engineering service as end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure.

16. Functional testing,repairs and inspection of the sub-finished and finished goods.

17. High mixed with low volume order is welcomed.

18. Products before delivery should be full quality checked, striving to 100% perfect.

19. One-stop service of PCB and SMT(PCB assembly) is supplied to our customers.

20. Best service with punctual delivery is always provided for our customers.

Key Specifications/Special Features
1 We JX have 30 PCB production lines and 20 advanced SMT lines with high speed.
2

All kinds of integrated circuits are accepted,such as SO, SOP, SOJ, TSOP, TSSOP,

QFP, DIP, CSP,BGA and U-BGA , Because Our placement precision can reach

chip +0.1mm on integrated circuit parts.

3 We SYF can provide service of 0201 chip placement, through-hole components insertion and finished products fabrication, testing and packaging.
4 SMT/SMD assembly and through-hole components insertion
5 IC preprogramming
6 Function verification and burn in testing
7 Complete unit assembly (which including plastics, metal box, coil, cable inside and more)
8 Environmental coating
9

Engineering including end of life components, obsolete component replace

and design support for circuit, metal and plastic enclosure

10 Packaging design and production of customized PCBA
11 100% quality assurance
12 High mixed, low volume order is also welcomed.
13 Full component procurement or the substitute components sourcing
14 UL,ISO9001:2008, ROSH ,REACH,SGS,HALOGEN-FREE compliant

PRODUCTION CAPABILITY OF PCB ASSEMBLY
Stencil Size Range 756 mm x 756 mm
Min. IC Pitch 0.30 mm
Max. PCB Size 560 mm x 650 mm
Min. PCB Thickness 0.30 mm
Min. Chip Size 0201 (0.6 mm X 0.3 mm)
Max. BGA Size 74 mm X 74 mm
BGA Ball Pitch 1.00 mm (Min) / F3.00 mm (Max)
BGA Ball Diameter 0.40 mm (Min) /F1.00 mm (Max)
QFP Lead Pitch 0.38 mm (Min) /F2.54 mm (Max)
Frequency of Stencil Cleaning 1 time / 5 ~ 10 Pieces
Type of Assembly SMT and Thru-hole
Solder Type Water Soluble Solder Paste,Leaded and Lead-free
Type of Service Turn-key,Partial Turn-key or consignment
File Formats Bill of Materials(BOM)
Gerber Files
Pick-N-Places(XYRS)
Components Passive Down to 0201 Size
BGA and VF BGA
Leadless Chip Carries/CSP
Double Sided SMT Assembly
BGA Repair and Reball
Part Removal and Replacement
Component Packaging Cut Tape,Tube,Reels,Loose Parts
Testing Method X-RAY Inspection and AOI Test
Order of Quantity High Mixed,Low Volume Order is also welcomed
Remarks: In order to get accurate quote,the following information is required
1 Complete Data of Gerber Files for the Bare PCB Board.
2

Electronic Bill of Material(BOM) / Parts list detailing manufacturer's part number, quantity usage

of components for reference.

3 Please state whether we can use alternative parts for passive components or not.
4 Assembly Drawings.
5 Functional Test Time Per Board.
6 Quality Standards Required
7 Send Us Samples (if available)
8 Date of the quote needs to be submitted

PRODUCTION CAPABILITY OF PCB

PROCESS Engineer
ITEMS Item
PRODUCTION CAPABILITY Manufacturing Capability
Laminate Type FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ,
ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON
Thickness 0.2~3.2mm
Production Type Layer Count 2L-16L
Surface Treatment HAL,Gold Plating,Immersion Gold,OSP,
Immersion Silver,Immersion Tin,Lead Free HAL
Cut Lamination Max. Working Panel size 1000×1200mm
Inner Layer Internal Core Thickness 0.1~2.0mm
Internal width/spacing Min: 4/4mil
Internal Copper Thickness 1.0~3.0oz
Dimension Board Thickness Tolerance ±10%
Interlayer Alignment ±3mil
Drilling Manufacture Panel Size Max: 650×560mm
Drilling Diameter ≧0.25mm
Hole Diameter Tolerance ±0.05mm
Hole Position Tolerance ±0.076mm
Min.Annular Ring 0.05mm
PTH+Panel Plating Hole Wall copper Thickness ≧20um
Uniformity ≧90%
Outer Layer Track Width Min: 0.08mm
Track Spacing Min: 0.08mm
Pattern Plating Finished Copper Thickness 1oz~3oz
EING/Flash Gold Nickel Thickness 2.5um~5.0um
Gold Thickness 0.03~0.05um
Solder Mask Thickness 15~35um
Solder Mask Bridge 3mil
Legend Line width/Line spacing 6/6mil
Gold Finger Nickel Thickness ≧120u〞
Gold Thickness 1~50u〞
Hot Air Level Tin Thickness 100~300u〞
Routing Tolerance of Dimension ±0.1mm
Slot Size Min:0.4mm
Cutter Diameter 0.8~2.4mm
Punching Outline Tolerance ±0.1mm
Slot Size Min:0.5mm
V-CUT V-CUT Dimension Min:60mm
Angle 15°30°45°
Remain Thickness Tolerance ±0.1mm
Beveling Beveling Dimension 30~300mm
Test Testing Voltage 250V
Max.Dimension 540×400mm
Impedance Control
Tolerance
±10%
Aspect Ration 12:1
Laser Drilling Size 4mil(0.1mm)
Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering and Gold Finger Are Acceptable
OEM&ODM Service

Yes

Acme Digital SMT Electronic PCB Assembly Turnkey Components PCBA 2 Years Guarantee
China Acme Digital SMT Electronic PCB Assembly Turnkey Components PCBA 2 Years Guarantee for sale

Acme Digital SMT Electronic PCB Assembly Turnkey Components PCBA 2 Years Guarantee

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