Shenzhen Jingxin Electronic Technology Co., Ltd.
Shenzhen Jingxin Electronic Technology Co., Ltd.
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Jingxin Co., Ltd is an electronics manufacturing service (EMS) provider located in Shenzhen, China, and has been operating since 2002.
We provide flexible and reliable electronic manufacturing solutions for customers, from parts procurement, PCBA placement, DIP soldering, PCBA testing, cabinet assembly and product testing,packing,logistics and other one-stop service.The company covers an area of 10,000 square meters, has about 600 employees, 20 high-precision SMT equipment production lines, 8 DIP plug-in production line, 4 product assembly test lines, and our equipment can meet the needs of many high-precision products. As a supplier of IS09001 quality system certification, we have accumulated rich experience in PCBA assembly and product manufacturing, and implemented strict quality management, which makes us have a good reputation in the same industry.
With years of export experience along with excellent quality, advanced services and competitive prices,Mezenda has won numerous customers' trust and support.
According to the complexity and simplicity of the product, when the parts are ready, we need 3-10 working days to prepare all the components.
Q1, who are we? Why choose us?
A1: We are an electronics manufacturing services (EMS) supplier, we provide customers with flexible and reliable electronic manufacturing solutions, from parts procurement, (board) PCBA processing, DIP through-hole soldering, PCBA testing, cabinet assembly and One-stop electronic manufacturing services such as product testing, packaging, and logistics.
A2: With a variety of different product introduction experience, we have established a team of perfect ISO9001 quality system certification, including: human resources, marketing department, project management, engineering technology, PMC procurement, quality management, production, warehouse management And many other departments. Our (EMS) electronics manufacturing services cover virtually every industry, including: industrial control, consumer electronics, automotive electronics, healthcare, security, power electronics, agriculture and defense, aerospace and more.
Q2, what information do we need to provide in order to get an accurate quote quickly?
A: The more detailed the product data and requirements are, the faster and more accurate the quotation will be, such as:
1. PCB manufacturing: Gerber files or PCB files
2. PCBA manufacturing: Gerber files, BOM bill of materials.
3. PCB requirements for sheet metal, thickness, copper thickness, tin spray, immersion gold, silk screen color, sheet color and other documents.
4. Comprehensive and detailed BOM bill of materials, including: part number, usage, specific specifications, parts manufacturers, etc.
5. Replaceable parts, confirm approved spare parts.
6. PCBA IC pre-programming, providing software burning test version, test method.
7. PCBA or product assembly requirements, providing specific executable files.
8. If plastic, metal, cable, packaging, etc. are required, a document drawing that can be produced is required.
9. For other special requirements, a schematic document is required.
Q3, what is the minimum requirement for the order?
A: We support customers to arrange the order quantity according to their own needs. There is no minimum quantity limit. Of course, the more orders, the more competitive the price competition.
Q4, How long is your order production time?
A: According to the complexity and simplicity of the product, when the parts are ready, we need 3-10 working days to prepare all the components.
| Rigid PCB Capacity for Prototypes PCBs and Mass Production | ||
| Features | Mass Capability | Prototypes Capability |
| Layers | 1-24 layers | 1-64 layers |
| Board material type | FR4(Standard FR4, Mid-Tg FR4,Hi-Tg FR4),CEM-1,ceramic substrate board, aluminum based board, Rogers , Teflon and more | FR4(Standard FR4, Mid-Tg FR4,Hi-Tg FR4),CEM-1, CEM-3,ceramic substrate board, aluminum based board, Rogers , Teflon and more |
| Max. PCB Panel Size | 1150*560mm | 1150*560mm |
| Board thickness coverage | .016"-.126"(0.4mm-3.2mm) | 0.2 to 5.00mm |
| Min. Board Thickness | 2L:0.2mm | 2L:0.2mm |
| 4L:0.4mm | 4L:0.4mm | |
| 6L:0.8mm | 6L:0.6mm | |
| Board thickness tolerance | ±10% | ±10% |
| Min Inner Layer Tracing/Spacing | 0.1mm(4mil) | 0.1mm(4mil) |
| Min outside layer Min Tracing/Spacing | 0.075mm(3/3mil) | 0.075mm(3/3mil) |
| Min drilling Hole diameter | 0.15mm(6mil) | 0.15mm(6mil) |
| Min plated hole thickness | 20um(0.8mil) | 20um(0.8mil) |
| Min Blind/Buried hole size | 0.2mm(8mil) | 0.2mm(1-8layers)(8mil) |
| Min Annular Ring | ±0.076mm(±3mil) | ±0.076mm(±3mil) |
| Hole Position Deviation | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
| Min width of cutout (NPTH) | 0.8mm | 0.8mm |
| Min width of slot hole (PTH) | 0.6mm | 0.6mm |
| Solder mask color | LPI, Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue | LPI, Green, Black, White, Red, Yellow, Blue |
| Silkscreen color | White, Yellow, Red, Black | White, Yellow, Red, Black |
| Surface finish | HASL ,Lead Free HASL | HASL ,Lead Free HASL |
| ENIG, Immersion Tin - RoHS | ENIG, Immersion Tin - RoHS | |
| OSP, ENIG+OSP, Immersion Silver, Gold Finger | OSP, ENIG+OSP, Immersion Silver, Gold Finger | |
| Special Process | Buried Hole,Blind Hole, Embedded Resistance, Back drillingand Resistance Control. | Buried Hole,Blind Hole, Embedded Resistance, Back drillingand Resistance Control. |
| Outline | Routing, V-Groove, Beveling punch | Routing,V-Groove, Beveling punch |
| Outline Tolerance | ±0.15mm ±6mil | ±0.15mm (±6mil) |
| Board thickness tolerance | +/-0.1mm ~ +/-10% | +/-0.1mm ~ +/-10% |
| Board size tolerance | +/-0.1mm~+/-0.3mm | +/-0.1mm~+/-0.3mm |
| PTH hole size tolerance | +/-.003"(+/-0.08mm)~+/-.006"(+/-0.15mm) | +/-.003"(+/-0.08mm)~+/-.006"(+/-0.15mm) |
| NPTH hole size tolerance | +/-.002"(+/-0.05mm) | +/-.002"(+/-0.05mm) |
| Controlled Impedance | +/- 10% | +/- 7% |
| Insulation Resistance | 1×1012Ω(Normal) | 1×1012Ω(Normal) |
| Through Hole Resistance | <300Ω(Normal) | <300Ω(Normal) |
| Thermal Shock | 3×10sec@288℃ | 3×10sec@288℃ |
| Warp and Twist | ≤0.7% | ≤0.7% |
| Electric Strength | >1.3KV/mm | >1.4KV/mm |
| Peel Strength | 1.4N/mm | 1.4N/mm |
| Solder Mask Abrasion | >6H | >6H |
| Flammability | 94V-0 | 94V-0 |
| Test Voltage | 50-330V | 50-330V |
