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Shenzhen JINGXIN Electronics Co., Ltd. was established In 2002, focus on ODM, OEM, SMT, PCBA and end-product assembly.10000 square meters area, 600 employees,total investment 70 million RMB.
Brand | Country | Machine | Model | Quantity |
Sony | Japan | High Speed Surface Mount Machine | SI-F130WR | 16 units |
Sony | Japan | Multifunction Surface Mount Machine | SI-F209 | 4 units |
Yamaha | Japan | Multifunction Surface Mount Machine | YV100XgP | 4 units |
Bluiris | China | SMT Intelligent Initial Sample Detection | FAI-600 | 1 unit |
Desen | China | Automatic visible screen printer | DSP-1008 | 8 units |
WEC | China | Automatic Loader | BL-250W-ST | 8 units |
Heller | USA | SMT Reflow Oven | 1809MK III | 4 units |
Yongxing | China | Industrial oven | YX-GL | 3 units |
ELT Group | USA | X-Ray | HT100 | 1 unit |
Sony | Japan | AOI | SI-V100 | 4 units |
Canyon | China | 3D-SPI | VCTA-V850 | 4 units |
Insun | China | AOI | YS-A6500 | 2 units |
Rigid PCB Capacity for Prototypes PCBs and Mass Production | ||
Features | Mass Capability | Prototypes Capability |
Layers | 1-24 layers | 1-64 layers |
Board material type | FR4(Standard FR4, Mid-Tg FR4,Hi-Tg FR4),CEM-1,ceramic substrate board, aluminum based board, Rogers , Teflon and more | FR4(Standard FR4, Mid-Tg FR4,Hi-Tg FR4),CEM-1, CEM-3,ceramic substrate board, aluminum based board, Rogers , Teflon and more |
Max. PCB Panel Size | 1150*560mm | 1150*560mm |
Board thickness coverage | .016"-.126"(0.4mm-3.2mm) | 0.2 to 5.00mm |
Min. Board Thickness | 2L:0.2mm | 2L:0.2mm |
4L:0.4mm | 4L:0.4mm | |
6L:0.8mm | 6L:0.6mm | |
Board thickness tolerance | ±10% | ±10% |
Min Inner Layer Tracing/Spacing | 0.1mm(4mil) | 0.1mm(4mil) |
Min outside layer Min Tracing/Spacing | 0.075mm(3/3mil) | 0.075mm(3/3mil) |
Min drilling Hole diameter | 0.15mm(6mil) | 0.15mm(6mil) |
Min plated hole thickness | 20um(0.8mil) | 20um(0.8mil) |
Min Blind/Buried hole size | 0.2mm(8mil) | 0.2mm(1-8layers)(8mil) |
Min Annular Ring | ±0.076mm(±3mil) | ±0.076mm(±3mil) |
Hole Position Deviation | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
Min width of cutout (NPTH) | 0.8mm | 0.8mm |
Min width of slot hole (PTH) | 0.6mm | 0.6mm |
Solder mask color | LPI, Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue | LPI, Green, Black, White, Red, Yellow, Blue |
Silkscreen color | White, Yellow, Red, Black | White, Yellow, Red, Black |
Surface finish | HASL ,Lead Free HASL | HASL ,Lead Free HASL |
ENIG, Immersion Tin - RoHS | ENIG, Immersion Tin - RoHS | |
OSP, ENIG+OSP, Immersion Silver, Gold Finger | OSP, ENIG+OSP, Immersion Silver, Gold Finger | |
Special Process | Buried Hole,Blind Hole, Embedded Resistance, Back drillingand Resistance Control. | Buried Hole,Blind Hole, Embedded Resistance, Back drillingand Resistance Control. |
Outline | Routing, V-Groove, Beveling punch | Routing,V-Groove, Beveling punch |
Outline Tolerance | ±0.15mm ±6mil | ±0.15mm (±6mil) |
Board thickness tolerance | +/-0.1mm ~ +/-10% | +/-0.1mm ~ +/-10% |
Board size tolerance | +/-0.1mm~+/-0.3mm | +/-0.1mm~+/-0.3mm |
PTH hole size tolerance | +/-.003"(+/-0.08mm)~+/-.006"(+/-0.15mm) | +/-.003"(+/-0.08mm)~+/-.006"(+/-0.15mm) |
NPTH hole size tolerance | +/-.002"(+/-0.05mm) | +/-.002"(+/-0.05mm) |
Controlled Impedance | +/- 10% | +/- 7% |
Insulation Resistance | 1×1012Ω(Normal) | 1×1012Ω(Normal) |
Through Hole Resistance | <300Ω(Normal) | <300Ω(Normal) |
Thermal Shock | 3×10sec@288℃ | 3×10sec@288℃ |
Warp and Twist | ≤0.7% | ≤0.7% |
Electric Strength | >1.3KV/mm | >1.4KV/mm |
Peel Strength | 1.4N/mm | 1.4N/mm |
Solder Mask Abrasion | >6H | >6H |
Flammability | 94V-0 | 94V-0 |
Test Voltage | 50-330V | 50-330V |
We offer multiple levels of service relating to electronic and electrical products, from design and prototyping through to delivering certified “turn-key” products and systems. We are best characterized as a complete solution provider. Main products include but not limited: Electronics design, Develop electronic control board, Remote control, LED related product, LCD display module, Electronic toys, Digital camera and their related creative electronic product.
In contrasting Magicelectro business model with an ODM model, Magicelectro is not bounded by the narrow design focus of the ODM world. We thrive at combining ideas and intelligent methods to create world class designs. When it comes to manufacturing we also have abundant experience in providing high cost-effectiveness product.
We are pleased to answer any questions that you may have. Please feel free to contact us.
1. Send us your product requirements
2. Our engineers will evaluate the feasibility and discuss with you if any question
3. Provide a rough solution / development schedule/ quotation
4. Provide demo/samples board to you for verification
5. Provide final solution include hardware and software, we are also able to serve customer with final product
A: We are factory.
A: Generally it is 5-10 days if the goods are in stock. or it is 15-20 days if the goods are not in stock, it is according to quantity.
A: No, we could not offer the sample for free.
A: Payment<=10000USD, 100% in advance. Payment>=10000USD, 50% T/T in advance ,balance before shippment.
Packing Details : Standard Carton,Vacuum Package,Antistatic Bubble Bag,According to customer requirement
Delivery Details : 3-30 days after order Confirmed