Shenzhen Jingxin Electronic Technology Co., Ltd.

Shenzhen Jingxin Electronic Technology Co., Ltd.

Manufacturer from China
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7 Years
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High Density Interconnect PCB Assembly Board SMT manufacturing

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Shenzhen Jingxin Electronic Technology Co., Ltd.
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrKevin
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High Density Interconnect PCB Assembly Board SMT manufacturing

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Brand Name :Jingxin
Model Number :JX81107S09
Certification :UL,RoHS, CE
Place of Origin :China
MOQ :1 pc
Price :Negotiable
Supply Ability :100000pcs per day
Packaging Details :ESD package
Number of Layers :4
Board Thickness :1.6mm-3.2mm
Min. Line Spacing :0.1um(3mil)
Type :pcba assembly
Certificate :UL/ROHS/ISO9001
Base Material :FR-4/aluminum/ceramic
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EMS pcba assembly factory, pcb and pcba turnkey service

Why Choose Us

QUICK RESPONSE & DELIVERY

CHEAPER WHILE GOOD QUALITY

SMALL QUANTITY RUNS

CERTIFIED MANUFACTURING CAPACITY

GLOBAL IC & COMPONENT SOURCING

ONE-STOP PCB & PCBA SERVICE

Who We Are

JINGXIN is a professional manufacturer of PCB & PCBA and EMS (electronics manufacturing service) with nearly 15-year experience in PCB Design & Layout, PCB Fabrication, PCB Assembly, PCBA Prototype, PCBA Test, Electronic Part Sourcing and EMS for kinds of smart electronic manufacturing.

SMT Processing
Now we have 20 SMT Lines and 8 DIP Lines to perform PCB assembly. The precision of chip replacement is up to +0.1MM, this indicates we have professional skills in producing all kinds of printed integrated circuit boards such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA with surface-mount technology (SMT), thru-hole technology (THT) and merged tech components.

DIP Processing
JINGXIN has 8 DIP processing lines, professional working platforms and carriers, this ensures a output capacity of 1 500 000pcs per day. For every process, technical and standard operation guidelines are made to follow, with strict KPI, this makes sure of 99.8% of pass for every PCBA. Lower our rejects, create more value for clients.

High Density Interconnect PCB Assembly Board SMT manufacturing

PCB Design & Layout

» Excellent Expertise in design tools: Allegro, Pads, and Mentor Expedition.
» High density SMT designs (BGA, uBGA, PCI, PCIE, CPCI…)
» Flex PCB designs of all sorts
» Complete assembly drawings
» In-Circuit Test data generation (ICT)
» Drill, panel and cutout drawings designed
» Professional fabrication documents created
» High-speed, multi-layer digital PCB designs- Bus routing, differential pairs, matched lengths; Fast PCB design in 2-3 days.
» Concentrate on the PCB design Wi-Fi Module, BLE Module, GPS Tracking application.RF Modules,Medical-Care devices,LED PCB Boards.
» We come up with the design as per customer requirement,and take care for the RAW material cost at the outset of design.
» Full control for the PCB design, from requirement, Schematic, PCB Layout, SI/PI/EMI inspection, we will locate the design issues in the inspection processing.
PCB Fabrication Center
We have produced all kinds of PCBs including FR4, FR1, CEM1, FPC, Metal Core PCB and Rogers PCB, etc. With the advantage of material and component sourcing channels, we have the ability of fast PCB sample--48 hours after order confirmation.
High Density Interconnect PCB Assembly Board SMT manufacturing
PCB Specifications
PCB layer 1, 2, 4 or 6, up to 18 layers
Board shape Rectangular, round, slots, cutouts, complex, irregular
Board type Rigid, flexible, rigid-flexible
Board material FR-4 glass epoxy, FR4 High Tg, RoHS compliant; Aluminum, Rogers, etc.
Board cutting Shear, V-score, tab-routed
Board thickness 0.2 ~ 4.0 mm (±10%), Flex board: 0.01 ~ 0.25″ (±10%)
Copper weight 1.0, 1.5, 2.0 Oz (tolerance ±0.25 oz)
Solder mask Double-sided green LPI, Also support red, white, yellow, blue, black
Silk screen Double-sided or single-sided in white,yellow, black, or negative
Silk screen min. line width 0.006″ or 0.15mm
Max board dimension 20 inch *20 inch or 500mm*500mm
Min. trace/gap 0.10mm, or 4 mils
Min. drill hole diameter 0.01”, 0.25mm, or 10 mils
Surface finish HASL, Nickle, Imm Gold, Imm Tin, Imm Silver, OSP etc.
Min.slot width 0.12”, 3.0 mm, or 120 mils
V-score depth 20-25% of board thickness
Plated through holes Yes
Design file format Gerber RS274X, 274D, Eagle and AutoCAD’s, DXF, DWG, Protel 99se
Supported Assembly Capabilities
Different types of Assembly
°THD (Thru-Hole Device)
°SMT (Surface-Mount Technology)
°SMT & THD combined
°2-sided SMT and THD assembly
Order Volume Allowed
°1 to 5,000 boards
Parts
°Passives parts, smallest size 0201
°Fine pitch to 8 Mils
°BGA, uBGA, QFN, POP and Zero-Lead chips
°Connectors and terminals
Component Package
°Reels
°Cut tape
°Tube and tray
°Loose parts and bulk
PCB Board Measurements
°Minimum measurement: 0.2″ x 0.2″ (5mm x 5mm)
°Largest dimension: 15″ x 20″ (381mm x 508mm)
Printed circuit board shapes
°Oblong
°Round
°Slots and Cut outs
°Complicated and Uncommon
PCB board kinds
°Rigid FR-4 boards
°Rigid-Flex boards
Assy procedures
°Leaded process
°Zero-Lead (RoHS)
Design file formatting
°Gerber RS-274X, 274D, Eagle as well as AutoCAD’s DXF, DWG
°BOM (Bill of Materials) (.xls, .csv, . xlsx)
°Centroid (Pick-N-Place Or XY file)
Testing Processes
°Visual Inspection
°X-ray Inspection
°AOI (Also known as: Automated Optical Inspection)
°ICT (AKA: In-Circuit Test)
°Functional testing
Turnaround time periods
°1 To 5 days for only printed circuit board assy
°10 To16 days for full Turnkey Circuit Card Assy
Turnkey PCB Board Assembly Solutions
•Rapid Turnaround •Prototype/Production Support •Blank Boards»Components»Assembly •Rapid On-line Quote
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