Shenzhen Jingxin Electronic Technology Co., Ltd.
Shenzhen Jingxin Electronic Technology Co., Ltd.
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Customized PCB Ems Oem Pcb Flash Gold PCB Pcba Assembly With Smt Dip
One-Stop Service:
1. PCB Copy
2. PCB drawing / design according to your schematic diagram
3. PCB manufacturing
4. Component sourcing
5. PCB Assembly
6. PCBA 100% test
OEM/ODM/EMS Services For PCBA:
· PCBA, PCB Board assembly: SMT & PTH & BGA
· PCBA and enclosure design
· Components sourcing and purchasing
· Quick prototyping
· Plastic injection molding
· Metal sheet stamping
· Final assembly
· Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
· Custom clearance for material importing and product exporting
| Capability - SMT | ||||
| Lines | 20 | |||
| Capacity | 52 million placements per month | |||
| Max Board Size | 457 X 356mm. (18” x 14”) | |||
| Min Component size | 0201 – 54 sq. mm. (0.084 sq. inch), long connector, CSP, BGA, QFP | |||
| Speed | 0.15 sec/chip, 0.7 sec/QFP | |||
| Capability - PTH | ||||
| Insertion Type | # of Lines | Capacity (points/mth) | Max Board Size | Lead Pitch |
| Jumper Wire | 3 | 6 million | 330X250 mm (13” x 9.8) | 5-30 mm |
| Axial | 3 | 6 million | 457x559 mm (18” x 22”) | 5-20 mm |
| Radial | 3 | 9 million | 457x559 mm (18” x 22”) | 0.36-21.5 mm |
| Wave Soldering | ||||
| Wave Soldering | 2 | |||
| Max board width | 400 mm | |||
| Type | Dual wave | |||
| Pbs Status | Lead-free line support | |||
| Max temp | 399 degree C | |||
| Spray flux | add-on | |||
| Pre-heat zones | 3 | |||
Detailed Terms for Pcb Assembly
| Quantity | Prototype&sample PCB Assembly, Small and middle mass prodution is our specialty and we also can handle the orders up to 2000. |
| Type of Assembly | THD (Thru-Hole Device), SMT (Surface-Mount Technology), Double-sided SMT & THD mixed |
| Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free. |
| Components | Passives parts, smallest size 0201; BGA, uBGA, QFN, POP, and Leadless chips; Fine Pitch to 0.8Mils; BGA Repair and Reball; Part Removal and Replacement Connectors and terminals. |
| Bare Board Size | Smallest: 0.25x0.25 Inches; Largest: 20x20 Inches. |
| File Formats | Bill of Materials Gerber Files Pick-N-Place File(XYRS). |
| Type of Service | Turn-Key, Partial Turn-Key or Consignment. |
| Component Packaging | Reels,cut tape,Tube and tray,Loose parts and bulk. |
| Turn Time | 3 - 10 days |
| Testing | X-ray Inspection AOI (Automated Optical Inspection) ICT (In-Circuit Test)/Functional Testing |
Components for your PCBA project can be supplied in any one or more approaches above.
We order genuine parts from your designated suppliers or our partner companies including DigiKey, Mouser, Arrow, Avnet, Future Electronics, Farnell.etc
PCB or PCB Assembly files requests
1. Gerber files of the bare PCB board
2. BOM (Bill of material) for assembly
To short the lead time, please kindly advise us if there is any acceptable components substitution.
3. Testing Guide & Test Fixtures if necessary
4. Programming files & Programming tool if necessary
5. Schematic if necessary
Application
PCBA Capability
| SMD Components Mounting | Stencil size range: 1560*450mm |
| 100% Automatic Solder Paste Machine | Min. SMT package: 0201 |
| BGA Assembly & CSP Assembly | Min. IC pitch: 0.3mm |
| COB Bonding | Max. PCB size: 1200*400mm |
| Dip Soldering, Wave Soldering & Hand Soldering (RoHS) | Min. PCB thickness: 0.35mm |
| 100% Automatic Optical Inspection (AOI) | Min. Chip Size: 01 005 |
| In-Circuit Testing (ICT), RF Shield Room & Functional Testing | Max. BGA Size: 74*74mm |
| Final Assembly and Casing Assembly | BGA ball pitch: 0.4 to 1.0mm |
| X-Ray Inspection and BGA Re-work Station | BGA ball diameter: 0.45 to 0.76mm |
| ODM Solution and Development | QFP lead pitch: 0.38 to 2.54mm |