Shenzhen Jingxin Electronic Technology Co., Ltd.
Shenzhen Jingxin Electronic Technology Co., Ltd.
Add to Cart
Multilayer Prototype EMS PCB Assembly High Volume PCB Manufacturing Process
Our capacity
| Item (PCB) | Manufacture Capacity |
| Layer | 1-20 layers |
| Material | FR4, High-TG FR4, CEM3,Aluminum,High Frequency(Rogers, Taconic,Aron,PTFE,F48) |
| Material Thickness (mm) | 0.2 to 4.0mm/Flex 0.01-0.25mm |
| Copper Thickness | 0.5-3.0oz |
| Min Line Space | 0.1mm(4mil) |
| Min Line Width | 0.1mm(4mil) |
| Hole | |
| Min Hole Size (mechanical) | 0.2mm |
| Min Hole Size(laser) | 0.1mm |
| Hole Size Tol(+/-) | PTH: ±0.075mm; NPTH:±0.05mm |
| Hole Position Tol | ±0.075mm |
| Plating | |
| HASL/LF HAL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-5" |
| Surface Finish | HAL, ENIG, Plated Gold, Immersion Gold, OSP |
| Copper Weight | 0.5-6oz |
| Color | |
| Solder Mask | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
| Silk Screen | White, Black, Blue, Yellow |
| Acceptable File Format | Gerber file, Powerpcb,CAD,AUTOCAD,ORCAD, P-CAD,CAM-350,CAM2000 |
| Certificate | ROSH, ISO9001,UL |
| Item (PCB Assembly) | Manufacture Capacity |
| Stencil Size | 700x700mm |
| Min IC Pitch | 0.2mm |
| Max PCB Size | 1200x500mm |
| Min PCB Thickness | 0.25mm |
| Min Chip Size | 0201(0.2x001)/0603(0.6x0.3mm) |
| Max BGA Size | 74x74mm |
| BGA Ball Diameter | 0.4mm(min),1.00mm(max) |
| BGA Ball Pitch | 1.00(min), 3.00mm(max) |
| QFP Lead Pitch | 0.38mm(min),2.54mm(max) |
| Assembly Type | Surface Mounting Assembly DIP Assembly Mixed (surface mount and through hole) technology Single or double sided placement Cable Assembly |
| Component Type | Passive Component As small as 0402 package As small as 0201 with design review Ball Grid Array (BGA) |
| Solder Type | Leaded Leaded-free/ROHS |
| Other Capabilities | Repair/Rework Service Mechanical Assembly Mold and Plastic injection |
Our Service
1. PCB design, PCB clone, ODM service, Android PCBA
2. Schematic design and layout
3. Fast PCB&PCBA prototype and mass production
4. Electronic components sourcing services
5. PCB Assembly services:SMT/DIP&THT,BGA repair and reballing
6. ICT, Constant Temperature Burn-in and Function Test
7. Stencil, Cables and Enclosure building
8. Standard Packing and On-Time Delivery
9. Support OEM service
Requested information for PCB assembly
1. Gerber file of the bare board/ electronic circuit board
2. BOM for PCB assembly (To shorten time, please kindly advise us if there is any acceptable components substitution)
3. Testing Guide & Test Fixtures if necessary
4. Programming files & Programming tool if necessary
5. Schematic if necessary
About Company
1. Shenzhen Jingxin Electronics Co., Ltd is a manufacturer specialized in PCB&PCBA manufacturing, related R&D over 14 years.
2. One stop turnkey services, including PCB board manufacturing, PCB layout, PCB assembly, components source, PCB board SMT, function testing, quality testing etc.
3. JINGXIN is the direct customer of original QUAL COMM/MTK/REALTEK and worked with Arrow, Avnet, WPG etc famous IC suppliers for over 10 years.
4. With 20 lines of SMT lines, 20 sets of famous brand Wifi testing machines, 500,000pcs of router production capacity.
5. Strict manufacturing and quality test control, machinery and labor work together to ensure testing quality.
6. OEM and ODM are warmly welcome.
7. Certifications: ISO 9001,CE RoHS, Nation High-tech industry.
Lead Time
| Sample | Mass Production | |
| Single Sided PCB | 1-3 days | 4-7 days |
| Double Sided PCB | 2-5 days | 7-10 days |
| Malti-layer PCB | 7-8 days | 10-15 days |
| PCB Assembly | 8-15 days | 15-20 days |