Shenzhen Jingxin Electronic Technology Co., Ltd.
Shenzhen Jingxin Electronic Technology Co., Ltd.
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Fr-4 Halogen Free PCB Assembly for Car Alarm Pcb Assembly Service
Key Specifications/Special Features:
BOM
Gerber file
Assembly drawing with any change notices
Dimension specifications for non-standard components
Test standard operation procedures
Please offer us acceptable components for substitution so as to shorten the lead time
If possible, please send prototype sample board to us for further reference.
We commit to offer high quality level circuit board to customer
Abundant experience and strong ability in material sourcing,manufacturing,test and quality management
Professional team in charge of product design
Circuit boards 1 to 28 layers PCB layout, fabrication, PCB assembly and box building
High-precision 0201 size components SMT technology
RoHS complaint SMT, DIP process
High-precision e-testing include: ICT in circuit,function test,AOI,BGA repair device and more
Flexible production volume follow different customer requirement
We offer quotation for clients within 3 working days and reply e-mail within 6 hours
Our services for the PCB Assembly
Re-layout for shortening the board size
Bare pc board fabrication
SMT/BGA/DIP assembly
Full component procurement or the substitute components sourcing
Wire harness and cable assembly
Metal parts, rubber parts and plastic parts including mold making
Mechanical, case and rubber molding assembly
Functional testing
Repairs and inspection of the sub-finished / finished goods
Our capabilities for the PCB Assembly
| Stencil Size Range | 736 mm x 736 mm |
| Min. IC Pitch | 0.30 mm |
| Max. PCB Size | 410 mm x 360 mm |
| Min. PCB Thickness | 0.35 mm |
| Min. Chip Size | 0201 (0.6 mm X 0.3 mm) |
| Max. BGA Size | 74 mm X 74 mm |
| BGA Ball Pitch | 1.00 mm (Min) / F3.00 mm (Max) |
| BGA Ball Diameter | 0.40 mm (Min) /F1.00 mm (Max) |
| QFP Lead Pitch | 0.38 mm (Min) /F2.54 mm (Max) |
| Frequency of Stencil Cleaning | 1 time / 5 ~ 10 Pieces |
PCBA Picture
