Shenzhen Jingxin Electronic Technology Co., Ltd.
Shenzhen Jingxin Electronic Technology Co., Ltd.
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IC Pre-programming Printed Circuit Board SMT PCB Assembly Service
Our capabilities for handling the Bare PC Board fabrication
Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD
Layers 1-18 L
Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers,
Isola, Taconic, Arlon, Teflon, Aluminum Based
Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm
Outline Tolerance ±4mil ±0.10mm
Board Thickness 8mil-236mil / 0.2mm-6.0mm
Board Thickness Tolerance ±10%
Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
Min. Track Width 3mil / 0.075mm
Min. Track Space 3mil / 0.075mm
External Cu Thickness HOZ-6OZ / 17um~210um
Internal Cu Thickness HOZ-6OZ / 17um~210um
Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
Finished Hole Dimension 4mil-236mil / 0.1mm—6.0mm
Hole Tolerance ±2mil / ±0.05mm
Hole Position Tolerance ±2mil / ±0.05mm
Laser Drilling Hole Size 4mil / 0.1mm
Aspect Ration 12:1
Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, etc.
Min Solder mask Bridge 2mil / 0.050mm
Plugged Hole Diameter 8mil-20mil / 0.20mm-0.50mm
Impedance Control V-scoring ±10%
Surface Finishing HASL, HASL(lead Free), Immersion Gold, Immersion Tin,
Immersion Silver, OSP, Hard Gold( up to 100u”)
UL and TS16949: 2002 marks
Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger
Profiling: punching, routing, V-cut and beveling
OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided
Our services for the PCB Assembly
1. Re-layout for shortening the board size
2. Bare pc board fabrication
3. SMT/BGA/DIP assembly
4. Full component procurement or the substitute components sourcing
5. Wire harness and cable assembly
6. Metal parts, rubber parts and plastic parts including mold making
7. Mechanical, case and rubber molding assembly
8. Functional testing
9.Repairs and inspection of the sub-finished / finished goods
Our capabilities for the PCB Assembly
| Stencil Size Range | 736 mm x 736 mm |
| Min. IC Pitch | 0.30 mm |
| Max. PCB Size | 410 mm x 360 mm |
| Min. PCB Thickness | 0.35 mm |
| Min. Chip Size | 0201 (0.6 mm X 0.3 mm) |
| Max. BGA Size | 74 mm X 74 mm |
| BGA Ball Pitch | 1.00 mm (Min) / F3.00 mm (Max) |
| BGA Ball Diameter | 0.40 mm (Min) /F1.00 mm (Max) |
| QFP Lead Pitch | 0.38 mm (Min) /F2.54 mm (Max) |
| Frequency of Stencil Cleaning | 1 time / 5 ~ 10 Pieces |
PCBA Picture
