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OEM ODM EMS 94v0 Power Bank Ems Pcb Assembly Immersion Gold Approved By UL ISO
PCB General Capability | |
Number of Layer | 1 - 20 Layer |
Maximum Processing Area | 680 × 1000MM |
Min Board Thickness | 2 Layer - 0.3MM ( 12 mil ) |
4 Layer - 0.4MM ( 16 mil ) | |
6 Layer - 0.8MM ( 32 mil ) | |
8 Layer - 1.0MM ( 40 mil) | |
10 Layer - 1.1MM ( 44 mil ) | |
12 Layer - 1.3MM ( 52 mil ) | |
14 Layer - 1.5MM ( 59 mil ) | |
16 Layer - 1.6MM ( 63 mil ) | |
18 Layer - 1.8MM ( 71 mil ) | |
Finished Board Thickness Tolerance | Thickness ≤ 1.0MM, Tolerance: ± 0.1MM |
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% | |
Twisting and Bending | ≤ 0.75%, Min: 0.5% |
Range of TG | 130 - 215 ℃ |
Impedance Tolerance | ± 10%, Min: ± 5% |
Hi-Pot Test | Max: 4000V/10MA/60S |
Surface Treatment | HASL, With Lead, HASL Free Lead |
Flash Gold, Immersion Gold | |
Immersion Silver, Immersion Tin | |
Gold Finger, OSP |
PCB Cu Thickness + Plating | |
Out Layer Cu Thickness | 1 - 6OZ |
Inner Layer Cu Thickness | 0.5 - 4OZ |
Cu Thickness of PTH | 20UM ≤ Average ≤ 25UM |
Min: 18UM | |
HASL with Lead | Tin 63% Lead 37% |
HASL Free Lead | 7UM ≤ Surface Thickness ≤ 12UM |
Thick Gold Plating | Ni Thickness: 3 - 5UM ( 120u" - 200u" ) |
Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" ) | |
Immersion Gold | Ni Thckness: 3 - 5UM ( 120u" - 200u" ) |
Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" ) | |
Immersion Silver | Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" ) |
Gold Finger | Ni Thickness: 3 - 5UM ( 120u" - 160u" ) |
Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" ) |
U940 PCB Pattern Limit Capability | |
Min Width | 0.075MM ( 3 mil ) |
Min Trace | 0.075MM ( 3 mil ) |
Min Width of Ring ( Inner Layer ) | 0.15MM ( 6 mil ) |
Min Width of Ring ( Out Layer ) | 0.1MM ( 4 mil ) |
Min Solder Bridge | 0.1MM ( 4 mil ) |
Min Height of Legend | 0.7MM ( 28 mil ) |
Min Width of Legend | 0.15MM ( 6 mil ) |
PCB Holes Processing Capability | |
Final Hole Size | Min: Laser 0.1MM, Machine 0.2MM |
Drilling Hole Size | 0.10 - 6.5MM |
Drilling Tolerance | NPTH: ±0.05MM, PTH: ±0.075MM |
Final Hole Size Tolerance ( PTH ) | φ0.20 - 1.60MM ± 0.075MM |
φ1.60 - 6.30MM ± 0.10MM | |
Final Hole Size Tolerance ( NPTH ) | φ0.20 - 1.60MM ± 0.05MM |
φ1.60 - 6.50MM ± 0.05MM | |
Drilling Strip Hole | -0L ~tu.'gth /width 2:1 |
Min Strip Hole Width 0.65MM | |
Length & Width Tolerance ± 0.05MM | |
Board Thickness / Hole Size | ≤ 10:1 |
PCB Cover Thickness Capability | |
Solder Mask Color | Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White |
Solder Mask Thickness | Surface Line ≥ 10UM |
Surface Line Corner ≥ 6UM | |
Surface Board 10 - 25UM | |
Solder Mask Bridge Width | |
Legend Color | White,Yellow,Black |
Min Height of Legend | 0.70MM ( 28 mil ) |
Min Width of Legend | 0.15MM ( 6 mil ) |
Blue Gel Thickness | 0.2 - 1.5MM |
Blue Gel Tolerance | ±0.15MM |
Carbon Print Thickness | 5 - 25UM |
Carbon Print Min Space | 0.25MM |
Carbon Print Impedance | 200Ω |
Blind/Burried/Half Via PCB Capability | |
Parameters | (1+1)e.g. (4-layer)blind via:1-2,2-4 (6-layer)buried via:2-3,3-4 (8-layer)blind/buried:1-3,4-5,6-8 |
Min Via | Laser 0.1MM, Machine 0.2MM |
Half Via | Min: 0.6MM |
Impedance Capability | |
Resistance Value | Single-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω |
Shenzhen Jingxin technology Co.,LTD. Is a professional design company of printed circuit board or printed circuit board assembly manufacturing.Founded in 2002, Nearly 20,000 square meters,the workshop area more than 600 employees,40,000 sq.m/design production capacity.The company has passed ISO9001-2000 certification and UL certification,ISO14001 certificate,and regarded as "shenzhen by shenzhen hi-tech enterprise". The company product widely used in communication,medical,industrial control,household appliances,etc,the products are mainly exported to southeast Asia,Europe and area.We can manufacture PCB,PCBA and other related products according to your demands.
FR4 PCBs with black mask (pcb board)
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2. OEM service
3. Gerber file needed
4. PCB clone with sample
5. Quality guarantee and professional after-sell service
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