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Shenzhen Jingxin Electronic Technology Co., Ltd.

Shenzhen Jingxin Electronic Technology Co., Ltd.

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7 Years
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Home / Products / Printed Circuit Board Assembly / High Density Interconnect Printed Circuit Board Assembly with X-Ray BGA 1OZ Copper thickness /

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Shenzhen Jingxin Electronic Technology Co., Ltd.
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrKevin
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High Density Interconnect Printed Circuit Board Assembly with X-Ray BGA 1OZ Copper thickness
High Density Interconnect Printed Circuit Board Assembly with X-Ray BGA 1OZ Copper thickness
  • High Density Interconnect Printed Circuit Board Assembly with X-Ray BGA 1OZ Copper thickness
  • High Density Interconnect Printed Circuit Board Assembly with X-Ray BGA 1OZ Copper thickness
Products Detailed
Detailed Product Description Material: FR4 Board Thickness: 1.2mm Copper Thickness: 1OZ Feature 1: Gerber/PCB File Needed Feature 2: 100% E-test ...
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