Shenzhen Jingxin Electronic Technology Co., Ltd.
Shenzhen Jingxin Electronic Technology Co., Ltd.
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OEM LED PCB Assembly Addressable LED WIFI controller Board Assembly
Based in Shenzhen, Shenzhen JINGXIN Technology Ltd specialize in electronic design, APP design, Housing design, PCB manufacture, PCB assembly, and component sourcing services, also could provide,
- PCB and PCBA Contract Manufacturing
- Reverse Engineering Services
- PCB Design and Assembly
- Component Procurement & Material Management
- Product Design
- Fast PCB&PCBA Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
- AOI,X-Ray Testing, other Function Testing Service
Main Equipments
| ITEM | Device Name | Model | Brand Name | Qty | Remarks |
| 1 | Full Automatic Screen Printer | DSP-1008 | DESEN | 8 | |
| 2 | SMT Machine | YG200 | YAMAHA | 5 | 20 SMT Line |
| 3 | SMT Machine | YV100XG | YAMAHA | 3 | |
| 4 | SMT Machine | YG100XGP | YAMAHA | 19 | |
| 5 | SMT Machine | YV88 | YAMAHA | 5 | |
| 6 | Reflow Soldering | 8820SM | NOUSSTAR | 4 | |
| 7 | Reflow Soldering | XPM820 | Vitronics Soltec | 3 | |
| 8 | Reflow Soldering | NS-800 II | JT | 1 | |
| 9 | Solder Paste Inspection | REAL-Z5000 | REAL | 1 | |
| 10 | Automatic Optical Inspection System | B486 | VCTA | 3 | |
| 11 | Automatic Optical Inspection System | HV-736 | HEXI | 5 | |
| 12 | X-Ray | AX8200 | UNICOMP | 1 | |
| 13 | BGA Re-work | MS8000-S | MSC | 1 | |
| 14 | Universal 4*48-pindrive concurrent multiprogramming system | Beehive204 | ELNEC | 3 | |
| 15 | Automatic Plug-In machines | XG-3000 | SCIENCGO | 2 | |
| 16 | Automatic wave soldering system | WS-450 | JT | 1 | 3 DIP LINE |
| 17 | Automatic wave soldering system | MS-450 | JT | 2 |
Bare Printed Circuit Board Process Capability:
| 1 | Layers | 1-18layers |
| 2 | Board material type | FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more |
| 3 | Compound material lamination | 4 to 6 layers |
| 4 | Maximum dimension | 610 x 1,100mm |
| 5 | Dimension tolerance | ±0.13mm |
| 6 | Board thickness coverage | 0.2 to 6.00mm |
| 7 | Board thickness tolerance | ±10% |
| 8 | DK thickness | 0.076 to 6.00mm |
| 9 | Minimum line width | 0.10mm |
| 10 | Minimum line space | 0.10mm |
| 11 | Outer layer copper thickness | 8.75 to 175µm |
| 12 | Inner layer copper thickness | 17.5 to 175µm |
| 13 | Drilling hole diameter (mechanical drill) | 0.25 to 6.00mm |
| 14 | Finished hole diameter (mechanical drill) | 0.20 to 6.00mm |
| 15 | Hole diameter tolerance (mechanical drill) | 0.05mm |
| 16 | Hole position tolerance (mechanical drill) | 0.075mm |
| 17 | Laser drill hole size | 0.10mm |
| 18 | Board thickness and hole diameter ratio | 10:1 |
| 19 | Solder mask type | Green, Yellow, Black, Purple, Blue, White and Red |
| 20 | Minimum solder mask | Ø0.10mm |
| 21 | Minimum size of solder mask separation ring | 0.05mm |
| 22 | Solder mask oil plug hole diameter | 0.25 to 0.60mm |
| 23 | Impedance control tolerance | ±10% |
| 24 | Surface finish | Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger |
PCBA Picture
