Shenzhen Jingxin Electronic Technology Co., Ltd.
Shenzhen Jingxin Electronic Technology Co., Ltd.
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Electronic DDouble Sided PCB Board Manufacturing Elevator Pcba Pcb Assembly
| Product Name | PCB/Circuit board | |
| NO | ITEM | Technical capabilities |
| 1 | Layers | 1-10 layers |
| 2 | Max.Board size | 2000×610mm |
| 3 | Min.Board Thickness | 2-layer 0.15mm |
| 4-layer 0.4mm | ||
| 6-layer 0.6mm | ||
| 8-layer 1.5mm | ||
| 10-layer 1.6-2.0mm | ||
| 4 | Min.line Width/Space | 0.1mm(4mil) |
| 5 | Max.Copper thickness | 10OZ |
| 6 | Min.S/M Pitch | 0.1mm(4mil) |
| 7 | Min.hole size | 0.2mm(8mil) |
| 8 | Hole dia.Tolerance(PTH) | ±0.05mm(2mil) |
| 9 | Hole dia.Tolerance(NPTH) | ±0.05mm(2mil) |
| 10 | Hole position deviation | ±0.05mm (2mil) |
| 11 | Outline tolerance | ±0.10mm (4mil) |
| 12 | Twist&Bent | 0.75% |
| 13 | Insulation Resistance | >1012 Ω Normal |
| 14 | Electric strength | >1.3kv/mm |
| 15 | S/M abrasion | >6H |
| 16 | Thermal stress | 288 ℃ 10 Sec |
| 17 | Test Voltage | 50-300V |
| 18 | Min.blind/buried via | 0.2mm(6mil) |
| 19 | Surface Finished | HAL,ENIG,Imsn OSP,Plating AG,Plating gold |
| 20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminum,Copper base |
Including Engineering, layout, programming,protyping, components sourcing, surface-mount assembly,through-hole assembly,inspection, test
2.Finished product manufacture: electronic PCBA part+housing+package...
Including plastic part, molding enclosure,metal processing,packages, etc.
3.Guarantee Period of Product and After-sale Service
1) Define warranty periold in the contract.
2) Within the warranty period, free maintenance or replacement of parts for the products,if any quality problem.
3) Beyond the warranty period ,charge for maintenance material only.
4) If products can not be mantained any more,we dispose the waste reasonablly, do not pollute the environment is very important!
