Shenzhen Jingxin Electronic Technology Co., Ltd.

Shenzhen Jingxin Electronic Technology Co., Ltd.

Manufacturer from China
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7 Years
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12L UL94v-0 Multilayer PCB Board High Density IPC Standards ROHS Certificated

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Shenzhen Jingxin Electronic Technology Co., Ltd.
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrKevin
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12L UL94v-0 Multilayer PCB Board High Density IPC Standards ROHS Certificated

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Brand Name :JINGXIN
Model Number :JX18112727
Certification :UL, Rohs
Place of Origin :CHINA
MOQ :1 PC
Price :Negotiation
Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :30000pcs per day
Delivery Time :5-7 days
Packaging Details :ESD Bag
Layer :12 L
Product Name :Multilayer PCB
Key Words :94v0 Rohs Pcb Board
Specialized In :High-precision
Quote needs :PCB Gerber file
Product Type :RGD ROHS PCB
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12L UL94v-0 multilayer pcb board High-density PCB IPC standards PCB

shenzhen custom electronic circuit board prototype manufacturer smt/smd service pcb assembly

1.Fast and one-stop service

2.Accept Design,Clone,OEM,ODM service

3.PCB+Components+PCBA

4.CE,ROHS,UL

5.quote within 24hours with Chinese and US office

Our Services

1) Design service

2) Cloning and Copy service

3) Prototyping service

4) Mold making and plastic Injection

5) FPC making

Multilayer 12 layers PCB board

1. OEM services provided

2. Certificate: ROHS, UL, ISO9001-2000, ISO14001

3. Factory direct price

4. Paypal available

Advantages

- No MOQ

- OEM services provided

- Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB manufacturable

- Factory direct price

- Replying with price in one working day

- Shipping within 24 hours

- Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

PCB Capacity

PCB General Capability
Number of Layer 1 - 18 Layer
Maximum Processing Area 680 × 1000MM
Min Board Thickness 2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16 mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM ( 59 mil )
16 Layer - 1.6MM ( 63 mil )
18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending ≤ 0.75%, Min: 0.5%
Range of TG 130 - 215 ℃
Impedance Tolerance ± 10%, Min: ± 5%
Hi-Pot Test Max: 4000V/10MA/60S
Surface Treatment HASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP
PCB Cu Thickness + Plating
Out Layer Cu Thickness 1 - 6OZ
Inner Layer Cu Thickness 0.5 - 4OZ
Cu Thickness of PTH 20UM ≤ Average ≤ 25UM
Min: 18UM
HASL with Lead Tin 63% Lead 37%
HASL Free Lead 7UM ≤ Surface Thickness ≤ 12UM
Thick Gold Plating Ni Thickness: 3 - 5UM ( 120u" - 200u" )
Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" )
Immersion Gold Ni Thckness: 3 - 5UM ( 120u" - 200u" )
Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" )
Immersion Silver Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" )
Gold Finger Ni Thickness: 3 - 5UM ( 120u" - 160u" )
Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" )
U940 PCB Pattern Limit Capability
Min Width 0.075MM ( 3 mil )
Min Trace 0.075MM ( 3 mil )
Min Width of Ring ( Inner Layer ) 0.15MM ( 6 mil )
Min Width of Ring ( Out Layer ) 0.1MM ( 4 mil )
Min Solder Bridge 0.1MM ( 4 mil )
Min Height of Legend 0.7MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
PCB Holes Processing Capability
Final Hole Size Min: Laser 0.1MM, Machine 0.2MM
Drilling Hole Size 0.10 - 6.5MM
Drilling Tolerance NPTH: ±0.05MM, PTH: ±0.075MM
Final Hole Size Tolerance ( PTH ) φ0.20 - 1.60MM ± 0.075MM
φ1.60 - 6.30MM ± 0.10MM
Final Hole Size Tolerance ( NPTH ) φ0.20 - 1.60MM ± 0.05MM
φ1.60 - 6.50MM ± 0.05MM
Drilling Strip Hole -0L ~tu.'gth /width 2:1
Min Strip Hole Width 0.65MM
Length & Width Tolerance ± 0.05MM
Board Thickness / Hole Size ≤ 10:1
PCB Cover Thickness Capability
Solder Mask Color Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
Solder Mask Thickness Surface Line ≥ 10UM
Surface Line Corner ≥ 6UM
Surface Board 10 - 25UM
Solder Mask Bridge Width
Legend Color White,Yellow,Black
Min Height of Legend 0.70MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
Blue Gel Thickness 0.2 - 1.5MM
Blue Gel Tolerance ±0.15MM
Carbon Print Thickness 5 - 25UM
Carbon Print Min Space 0.25MM
Carbon Print Impedance 200Ω
Blind/Burried/Half Via PCB Capability
Parameters

(1+1)e.g.

(4-layer)blind via:1-2,2-4

(6-layer)buried via:2-3,3-4

(8-layer)blind/buried:1-3,4-5,6-8

Min Via Laser 0.1MM, Machine 0.2MM
Half Via Min: 0.6MM
Impedance Capability
Resistance Value Single-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω

Why us?

Quality

Our UL/Rohs standards insure quality assemblies from start to finish. Whether it's a simple custom product or a complex turnkey production run, JINGXIN promises to give customers the highest quality standards.

Capable

JINGXIN offers the best capabilities in assembly insuring that quality is high.

Experience

When it comes to your build you want a partner you can depend on. Our management team has over 10 years of combined industry knowledge. Our engineering team has over 7 years experience.

Protecting your interests

Protecting your Intellectual Property is job one! Our staff of trained professionals are all working under a strict confidentiality contract and treat your important documentation as they would their own.

Flexibility

We pride ourselves on our ability to custom tailor programs around our customers' needs. We take time to listen to your unique business needs and then set out to surpass them.

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12L UL94v-0 Multilayer PCB Board High Density IPC Standards ROHS Certificated

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